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Pick & Place
SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components.
A Reflow Oven Machines used primarily for reflow soldering of surface mount electronic components to printed circuit boards. The oven contains multiple zones, which can be individually controlled for temperature.The PCB moves through the oven on a conveyor belt, and is therefore subjected to a controlled time-temperature profile.
Depanelling, Laser Markings, Laser Welding
Depanelling, Laser Markings, Laser Welding automation and laser applications form a unique combination that provides a technological advantage. Solutions are tailored to the customer’s needs utilizing flexible product platforms, which will also shorten lead times. Standard machine platforms include odd-form component placement, PCB de-paneling, laser applications, test handling and production IT to meet the tough demands driven by quality and traceability demands.
Dispensing - Specialty Coating Systems (SCS)
The SCS Dispense Platform is a fully programmable, multi-purpose system that offers unparalleled programming for efficiency in automated material application. Multi-functional, multi-valve technologies allow for the application of dots, lines, fills and globtops, all within one system.
Contact: Specialty Coating Systems (SCS)
In Line Batch Cleaners
In Line Batch Cleaners are high performance cleaning systems. From general purpose to high reliability requirements, AAT systems are design-driven by the science of cleaning. Our systems include batch and inline; aqueous and solvent; spray in air and spray under immersion with ultrasonics.
Contact: Austin American Tech
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven in a traditional surface-mount technology(SMT) assembly process.
Vapor Phase Soldering
Vapour-phase soldering is accomplished with the aid of a hot vapour. Heat transfer in condensation soldering is up to ten times higher than with convection soldering. This is particularly suitable for handling large or high-mass boards in a stable process atmosphere
SMT Feeders consist of the automation of surface-mount assembly by the use of pick-and-place equipment to handle tiny components has been enhanced by evolutionary improvements in tape-and-reel systems which can accommodate as many as 4000 parts on a 13-inch reel. This results in less frequent component reloading and less downtime of the assembly equipment.
AOI - Cyber Optics
AOI Systems are designed for both pre-reflow and post-reflow inspection covering a comprehensive list of component and solder joint defect categories and are fully capable of inspecting 01005 components and beyond.
Contact: Cyber Optics
Rework is the term for the refinishing operation or repair of an electronic printed circuit board assembly, usually involving desoldering and re-soldering of surface-mounted electronic components.